Carrier tape, method for manufacturing same, and method for manufacturing rfid tag

ABSTRACT

A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body with housing holes including bottom surfaces along a longitudinal direction, providing chip-shaped electronic components respectively into the housing holes, affixing a tape-shaped seal material having an adhesive layer on one principal surface to the tape-shaped main body such that the adhesive layer covers the housing holes and adheres to the electronic components, and forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication 2015-123051 filed on Jun. 18, 2015 and is a ContinuationApplication of PCT/JP2016/064370 filed on May 13, 2016. The entirecontents of each of these applications are hereby incorporated byreference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for manufacturing an RFID(radio frequency identifier) tag, a carrier tape used for manufacturingthe RFID tag, and a method for manufacturing the carrier tape.

2. Description of the Related Art

For an article information management system, an RFID system hasrecently been used and the RFID system allows a reader/writer and anRFID tag applied to an article to communicate in a non-contact mannerutilizing a magnetic field or an electromagnetic field so as to transmitpredetermined information.

The RFID tag is manufactured by attaching an RFIC element (an RFIC(radio frequency integrated circuit) chip itself or a package equippedwith an RFIC chip) to an antenna base material provided with an antennaelement. Conventionally known methods for connecting the RFIC elementand the antenna element include methods for connection by heating andmelting of solder, a conductive adhesive, and other suitable adhesive(see JP No. 2009-87068 A and JP No. 2009-129093 A) and methods forconnection by ultrasonic bonding (see JP No. 2012-32931 A and JP No.2013-45780 A).

However, in the methods for connection by heating and melting of solder,a conductive adhesive, or other suitable adhesive, a connection portionbetween the RFIC element and the antenna element must be heated to themelting point of the solder, the conductive adhesive, or the othersuitable adhesive or higher. In this case, since the antenna basematerial is required to have high heat resistance, an inexpensivematerial, such as polyethylene terephthalate (PET) cannot be used forthe antenna base material. In the methods for connection by ultrasonicbonding, a bump must be melted ultrasonically. This leads to problemssuch as a long time required for completing the ultrasonic bonding, andchanges in the quality and the shape of polyethylene terephthalate (PET)that is the antenna base material at the temperature at which the bumpmelts.

If the antenna base material has flexibility, the RFID tag can beaffixed to a member having a curved surface or a flexible material.However, the conventional methods for connection as described above maycause stress to concentrate on a connection portion between the RFIDelement and the antenna element and the connection portion may bedamaged or destroyed. Therefore, a new method is desired for connectingan electronic component, such as the RFIC element, and a connectionobject, such as the antenna element.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a carrier tape, amethod for manufacturing the same, and a method for manufacturing anRFID tag capable of improving the handleability of a component used in amethod for connecting an electronic component and a connection object.

A method for manufacturing a carrier tape according to a preferredembodiment of the present invention is a method for manufacturing acarrier tape that houses a plurality of electronic components with sealmaterials, the method including the steps of preparing a tape-shapedmain body including a plurality of housing holes including bottomsurfaces along a longitudinal direction; providing chip-shapedelectronic components respectively in the plurality of the housingholes; affixing a tape-shaped seal material including an adhesive layeron one principal surface to the tape-shaped main body, such that theadhesive layer covers the housing holes and adheres to the electroniccomponents; and forming cuts in the tape-shaped seal material toseparate portions defining and functioning as the seal materialsincluding portions at least partially overlapping with the respectivehousing holes in a planar view from the other portions.

A carrier tape according to a preferred embodiment of the presentinvention is a carrier tape that houses a plurality of electroniccomponents with seal materials, including a tape-shaped main body thatincludes a plurality of housing holes including bottom surfaces along alongitudinal direction; a plurality of chip-shaped electronic componentsrespectively housed in the plurality of the housing holes; and aplurality of seal materials including an adhesive layer on one principalsurface and affixed to the tape-shaped main body, such that the adhesivelayer covers the housing holes and adheres to the electronic components.

A method for manufacturing an RFID tag according to a preferredembodiment of the present invention includes the steps of preparing acarrier tape housing a plurality of RFIC elements with seal materials,the carrier tape including a tape-shaped main body that includes aplurality of housing holes including bottom surfaces along alongitudinal direction, a plurality of chip-shaped RFIC elementsrespectively housed in the plurality of the housing holes, and aplurality of seal materials including an adhesive layer on one principalsurface and affixed to the tape-shaped main body, such that the adhesivelayer covers the housing holes and adheres to the RFIC elements; foldingthe tape-shaped main body to separate each of the RFIC elements withseal materials from the tape-shaped main body; and affixing theseparated RFIC element with a seal material to an antenna base materialby the adhesive layer of the seal material.

Various preferred embodiments of the present invention improve thehandleability of a component used in a method for connecting anelectronic component and a connection object.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a plan view of a general configuration of a carrier tapeaccording to a first preferred embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along a line A1-A1 of FIG. 1.

FIG. 3 is a perspective view of a general configuration of an electroniccomponent with a seal material.

FIG. 4A is a cross-sectional view of an example of a method formanufacturing the carrier tape of FIG. 1.

FIG. 4B is a cross-sectional view of a step continued from FIG. 4A.

FIG. 4C is a cross-sectional view of a step continued from FIG. 4B.

FIG. 4D is a cross-sectional view of a step continued from FIG. 4C.

FIG. 4E is a cross-sectional view of a step continued from FIG. 4D.

FIG. 5 is a perspective view of a method for manufacturing an RFID tagaccording to a preferred embodiment of the present invention.

FIG. 6 is a plan view of an antenna element and an antenna basematerial.

FIG. 7 is a cross-sectional view taken along a line A2-A2 of FIG. 6.

FIG. 8 is a plan view of a state in which the electronic component witha seal material is attached onto the antenna element.

FIG. 9 is a cross-sectional view taken along a line A3-A3 of FIG. 8.

FIG. 10 is a side view of an example of a method for manufacturing aplurality of RFID tags according to a preferred embodiment of thepresent invention using the carrier tape of FIG. 1.

FIG. 11 is an enlarged cross-sectional view of a portion surrounded by adotted line of FIG. 10.

FIG. 12 is a side view of another example of the method formanufacturing a plurality of RFID tags according to a preferredembodiment of the present invention using the carrier tape of FIG. 1.

FIG. 13 is an enlarged cross-sectional view of a portion surrounded by adotted line of FIG. 12.

FIG. 14 is a perspective view of an RFIC element that is an example ofan electronic component according to a preferred embodiment of thepresent invention.

FIG. 15 is a cross-sectional view of the RFIC element shown in FIG. 14taken along a line X1-X1.

FIG. 16A is a plan view of an upper insulation layer of a multilayersubstrate making up the RFIC element shown in FIG. 14 viewed fromdirectly above.

FIG. 16B is a plan view of an intermediate insulation layer of themultilayer substrate making up the RFIC element shown in FIG. 14 viewedfrom directly above.

FIG. 16C is a plan view of a lower insulation layer of the multilayersubstrate making up the RFIC element shown in FIG. 14 viewed fromdirectly above.

FIG. 17A is a cross-sectional view of the insulation layer shown in FIG.16A taken along a line B1-B1.

FIG. 17B is a cross-sectional view of the insulation layer shown in FIG.16B taken along a line B2-B2.

FIG. 17C is a cross-sectional view of the insulation layer shown in FIG.16C taken along a line B3-B3.

FIG. 18 is a diagram of an equivalent circuit of the RFIC element shownin FIG. 14.

FIG. 19 is a diagram of an example of a state of a magnetic fieldoccurring on the equivalent circuit shown in FIG. 18.

FIG. 20 is a diagram of distribution of rigid and flexible regions inthe RFIC element shown in FIG. 14.

FIG. 21 is a diagram of a bent state of an RFID tag having the RFICelement shown in FIG. 14 attached to an antenna element.

FIG. 22 is a diagram of an example in which a current flows through anequivalent circuit of the RFID tag of FIG. 21.

FIG. 23 is a graph of an example of resonance frequency characteristicsof the RFID tag of FIG. 21.

FIG. 24 is a perspective view of a general configuration of anelectronic component with a seal material according to a secondpreferred embodiment of the present invention.

FIG. 25 is a plan view of a state of the electronic component with aseal material of FIG. 24 attached to an antenna element of an antennabase material.

FIG. 26 is a bottom view of a state of the electronic component with aseal material of FIG. 24 in which the portions other than those definingand functioning as the seal materials are separated from a tape-shapedmain body.

FIG. 27 is a perspective view of a general configuration of anelectronic component with a seal material according to a third preferredembodiment of the present invention.

FIG. 28 is a plan view of a state of the electronic component with aseal material of FIG. 27 attached to an antenna element of an antennabase material.

FIG. 29 is a bottom view of a state of the electronic component with aseal material of FIG. 27 in which the portions other than those definingand functioning as the seal materials are separated from the tape-shapedmain body.

FIG. 30 is a cross-sectional view of a general configuration of acarrier tape according to a fourth preferred embodiment of the presentinvention.

FIG. 31 is a cross-sectional view of a general configuration of acarrier tape according to a fifth preferred embodiment of the presentinvention.

FIG. 32 is a plan view of a general configuration of a carrier tapeaccording to a sixth preferred embodiment of the present invention.

FIG. 33 is a cross-sectional view taken along a line C1-C1 of FIG. 32.

FIG. 34 is a perspective view of a general configuration of theelectronic component with a seal material.

FIG. 35 is a perspective view of a general configuration of amodification example of the electronic component with a seal material.

FIG. 36A is a perspective view of an example of a method formanufacturing the carrier tape according to the sixth preferredembodiment of the present invention.

FIG. 36B is a perspective view of a step continued from FIG. 36A.

FIG. 36C is a perspective view of a step continued from FIG. 36B.

FIG. 36D is a perspective view of a step continued from FIG. 36C.

FIG. 36E is a perspective view of a step continued from FIG. 36D.

FIG. 37 is a perspective view of a method for manufacturing an RFID tagaccording to a preferred embodiment of the present invention.

FIG. 38 is a plan view of an antenna material and an antenna elementthat are components of the RFID tag.

FIG. 39 is a cross-sectional view taken along a line C2-C2 of FIG. 38.

FIG. 40 is a plan view of a state in which the electronic component witha seal material is attached onto the antenna element.

FIG. 41 is a cross-sectional view taken along a line C3-C3 of FIG. 40.

FIG. 42 is a perspective view of a modification example of the methodfor manufacturing an RFID tag according to a preferred embodiment of thepresent invention.

FIG. 43 is a side view of an example of a method for manufacturing aplurality of RFID tags according to a preferred embodiment of thepresent invention using the carrier tape of FIG. 32.

FIG. 44 is an enlarged cross-sectional view of a portion surrounded by adotted line of FIG. 43.

FIG. 45 is a side view of another example of the method formanufacturing a plurality of RFID tags according to a preferredembodiment of the present invention using the carrier tape of FIG. 32.

FIG. 46 is an enlarged cross-sectional view of a portion surrounded by adotted line of FIG. 45.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

As described above, a new connection method is needed for connecting anelectronic component, such as an RFIC element, and a connection object,such as an antenna element. Therefore, the present applicant is makingprogress in the development of an electronic component with a sealmaterial acquired by affixing the electronic component to an adhesivelayer on one principal surface of the seal material. This electroniccomponent with a seal material is used in such a manner that the sealmaterial is affixed by the adhesive layer to the connection object so asto bring a terminal electrode on the electronic component into contactwith the connection object.

In this case, the terminal electrode of the electronic component is ableto be brought into contact with the connection object to retainelectrical contact between the terminal electrode of the electroniccomponent and the connection object. Additionally, the connectionbetween the electronic component and the connection object is able to bemaintained by affixing the seal material to the connection object, andthis eliminates the need for direct ultrasonic fixation or fixationusing a bonding material between the terminal electrode of theelectronic component and the connection object.

Therefore, even when the connection object is bent, a stress isprevented from concentrating on a connection portion between theelectronic component and the connection object, and the connectionportion is prevented from being damaged or destroyed.

As a result of intensive research for improving the handleability of theelectronic component with a seal that is a component used in the newmethod for connection described above, the following preferredembodiments of the present invention were conceived and developed by thepresent applicant.

A method for manufacturing a carrier tape according to a preferredembodiment of the present invention is a method for manufacturing acarrier tape that houses a plurality of electronic components with sealmaterials, the method including the steps of preparing a tape-shapedmain body that includes a plurality of housing holes including bottomsurfaces along a longitudinal direction; providing chip-shapedelectronic components respectively into the plurality of the housingholes; affixing a tape-shaped seal material including an adhesive layeron one principal surface to the tape-shaped main body such that theadhesive layer covers the housing holes and adheres to the electroniccomponents; and forming cuts in the tape-shaped seal material toseparate portions defining and functioning as the seal materialsincluding portions at least partially overlapping with the respectivehousing holes in a planar view from the other portions.

According to this method for manufacturing, the plurality of theelectronic components with seal materials is housed in the carrier tapeand, therefore, the handleability of the plurality of the electroniccomponents with seal materials is improved. Additionally, since the sealmaterials necessary for manufacturing RFID tags are affixed to thetape-shaped main body in order to retain the electronic components, itis not necessary to provide another member that is unnecessary formanufacturing RFID tags in order to retain the electronic components inthe housing holes. Therefore, the number of manufacturing steps and themanufacturing costs are reduced.

The depth of the housing holes may preferably be the same orsubstantially the same as the thickness of the electronic components orless than the thickness of the electronic components. In this case, theseal materials and the electronic components are ensured to be broughtinto contact with each other, and the seal materials and the electroniccomponents are able to be more securely bonded through the adhesivelayer.

A method for manufacturing a carrier tape according to a preferredembodiment of the present invention may preferably further include astep of separating the portions other than those defining andfunctioning as the seal materials from the tape-shaped main body afterthe cuts are formed in the tape-shaped seal material.

According to this method for manufacturing, when the electroniccomponents with seal materials are separated from the tape-shaped mainbody, the electronic components with seal materials are separated afterthe portions other than those defining and functioning as the sealmaterials are removed, and therefore are more easily separated.

The electronic components may each preferably include a pair of terminalelectrodes on a surface on the side opposite to a fixation surface fixedto the adhesive layer of the seal material.

Preferably, the electronic components may each include a pair ofterminal electrodes and may each be fixed through the pair of theterminal electrodes to the adhesive layer of the seal material.

A carrier tape according to a preferred embodiment to the presentinvention includes a tape-shaped main body including a plurality ofhousing holes including bottom surfaces along a longitudinal direction;a plurality of chip-shaped electronic components respectively housed inthe plurality of the housing holes; and a plurality of seal materialsincluding an adhesive layer on one principal surface and affixed to thetape-shaped main body such that the adhesive layer covers the housingholes and adheres to the electronic components.

According to this carrier tape, the plurality of the electroniccomponents with seal materials is housed in the carrier tape and,therefore, the handleability of the plurality of the electroniccomponents with seal materials is improved. Additionally, since the sealmaterials necessary for manufacturing RFID tags are affixed to thetape-shaped main body to retain the electronic components, it is notnecessary to provide another member that is unnecessary formanufacturing RFID tags to retain the electronic components in thehousing holes. Therefore, the number manufacturing steps and themanufacturing costs are reduced.

Preferably, the seal materials have a higher rigidity than thetape-shaped main body. As a result, when the tape-shaped main body isfolded, the separation of the seal materials from the tape-shaped mainbody is facilitated.

The electronic components may preferably be components that define RFIDtags and may each include an RFIC chip and a substrate equipped with theRFIC chip.

The substrate may preferably be a substrate that defines a RFID tag andmay include a power feeding circuit to provide impedance matchingbetween an antenna element and the RFIC chip.

Preferably, the electronic components may each include a pair ofterminal electrodes and may each be fixed through the pair of theterminal electrodes to the adhesive layer of the seal material.

A method for manufacturing an RFID tag according to a preferredembodiment of the present invention includes the steps of preparing acarrier tape housing a plurality of RFIC elements with seal materials,the carrier tape including a tape-shaped main body that includes aplurality of housing holes including bottom surfaces along alongitudinal direction, a plurality of chip-shaped RFIC elementsrespectively housed in the plurality of the housing holes, and aplurality of seal materials including an adhesive layer on one principalsurface and affixed to the tape-shaped main body such that the adhesivelayer covers the housing holes and adheres to the RFIC elements; foldingthe tape-shaped main body to separate each of the RFIC elements withseal materials from the tape-shaped main body; and affixing theseparated RFIC element with a seal material to an antenna base materialby the adhesive layer of the seal material.

According to this method for manufacturing, the RFIC elements with sealmaterials are the plurality of the electronic components with sealmaterials and are housed in the carrier tape and, therefore, thehandleability of the plurality of the RFIC elements with seal materialsis improved. Additionally, since the seal materials necessary formanufacturing the RFID tags are affixed to the tape-shaped main body toretain the RFIC elements, it is not necessary to provide another memberthat is unnecessary for manufacturing the RFID tags to retain the RFICelements in the housing holes. Moreover, since the electronic componentswith seal materials are separated from the tape-shaped main body bysimply folding the tape-shaped main body, the number manufacturing stepsand the manufacturing costs are reduced.

The carrier tape may preferably be wound around a supply reel, and whilethe carrier tape is continuously pulled out from the supply reel, thetape-shaped main body of the pulled-out carrier tape may be folded at acertain position away from the supply reel to sequentially separate theplurality of the RFIC elements with seal materials from the tape-shapedmain body.

According to this method for manufacturing, the plurality of the RFICelements are able to be separated from the tape-shaped main body at highspeed. Consequently, a plurality of RFID tags are able to bemanufactured in a shorter amount of time.

Preferably, the seal materials have a shape (e.g., a rectangular orsubstantially rectangular shape) having a longitudinal direction and atransverse direction in a planar view and, when each of the RFICelements with seal materials is separated from the tape-shaped mainbody, a portion in the longitudinal direction of the seal material isfirst separated. As a result, the RFIC elements with seal materials aremore easily separated from the tape-shaped main body.

Preferably, the RFIC elements each include a pair of terminal electrodesand may be each fixed through the pair of the terminal electrodes to theadhesive layer of the seal material, and when the RFIC elements withseal materials are each affixed to the antenna base material by theadhesive layer of the seal material, a portion of each of the pair ofthe terminal electrodes may be connected to an antenna conductorprovided on the antenna base material.

Preferred embodiments of the present invention will now be describedwith reference to the drawings.

First Preferred Embodiment

FIG. 1 is a plan view of a general configuration of a carrier tapeaccording to a first preferred embodiment of the present invention. FIG.2 is a cross-sectional view taken along a line A1-A1 of FIG. 1. FIG. 3is a perspective view of a general configuration of an electroniccomponent with a seal material.

As shown in FIG. 1 or 2, a carrier tape 1 according to the firstpreferred embodiment is configured to house a plurality of electroniccomponents 2 with seal materials. More specifically, the carrier tape 1includes a tape-shaped main body 3, a plurality of seal materials 4, anda plurality of chip-shaped electronic components 5.

The tape-shaped main body 3 is preferably a belt-shaped member, forexample, that includes a plurality of housing holes 3 a including bottomsurfaces on one principal surface. The plurality of the housing holes 3a is disposed along the longitudinal direction of the tape-shaped mainbody 3. The arrangement intervals of the housing holes 3 a arepreferably equal or substantially equal intervals, for example. Thehousing holes 3 a preferably have a size that is slightly larger thanthe electronic components 5 so that the electronic components 5 areentirely housed in a planar view while a gap of about 0.1 mm to about 2mm, for example, is provided around the electronic components 5. The“planar view” refers to a view in the direction shown in FIG. 1. Thetape-shaped main body 3 preferably includes a member having flexibility,such as polyethylene terephthalate (PET) and paper, for example. Thethickness of the tape-shaped main body 3 is preferably about 50 μm toabout 800 μm, for example. In the first preferred embodiment, the depthof the housing holes 3 a is preferably equal or substantially equal tothe thickness of the electronic components 5. Both end portions in thewidth direction of the tape-shaped main body 3 are preferably providedwith a plurality of feed holes 3 d along the longitudinal direction ofthe tape-shaped main body 3. Suction holes may be provided fortemporarily sucking and fixing the electronic components 5 until theelectronic components are fixed by the seal materials 4 after disposingthe electronic components 5 in the bottom portions of the housing holes3 a.

The seal materials 4 are each affixed to, for example, an antenna basematerial 11 described later to retain an electrical connection betweenan antenna element 12, that is an example of a connection object, andthe electronic component 5. Each of the seal materials 4 includes anadhesive layer 4 a on one principal surface thereof. The adhesive layer4 a is preferably provided on the entire or substantially the entire oneprincipal surface of the seal material 4, for example. The sealmaterials 4 are affixed to one principal surface of the tape-shaped mainbody 3 such that the adhesive layers 4 a are exposed in the housingholes 3 a. The one principal surface of the tape-shaped main body 3 issubjected to a release treatment. In the first preferred embodiment, theseal materials 4 preferably have a size larger than the housing holes 3a so as to completely cover the housing holes 3 a. The seal materials 4preferably include members having flexibility and elasticity, such aspolyethylene, polypropylene, polyvinyl butyral (PVB), and paper, forexample. The thickness of the seal materials 4 is preferably about 20 μmto about 200 μm, for example.

The electronic components 5 are housed in the housing holes 3 a andbonded to the adhesive layers 4 a of the seal materials 4. In the firstpreferred embodiment, the electronic components 5 are preferably RFICelements (packages or straps with RFIC chips sealed therein), forexample. As shown in FIG. 3, each of the electronic components 5includes a first terminal electrode 5 a and a second terminal electrode5 b on a surface on the side opposite to a fixation surface fixed to theadhesive layer 4 a of the seal material 4. The first terminal electrode5 a and the second terminal electrode 5 b are provided on a substrate 5c including an RFIC chip. The substrate 5 c is preferably made of aflexible material, such as a liquid crystal polymer resin or a polyimideresin, for example. The height (thickness) of the electronic components5 is preferably about 50 μm to about 1 mm, for example.

In the carrier tape according to the first preferred embodiment, theplurality of the electronic components 2 with seal materials is housedin the carrier tape 1 and, therefore, the handleability of the pluralityof the electronic components 2 with seal materials is improved.Additionally, since the seal materials 4 necessary for manufacturingRFID tags are affixed to the tape-shaped main body 3 to retain theelectronic components 5, it is not necessary to provide another memberthat is unnecessary for manufacturing RFID tags to retain the electroniccomponents 5 in the housing holes 3 a. Therefore, the number ofmanufacturing steps and the manufacturing costs are reduced.

Although the electronic components 5 are preferably RFIC elements in thefirst preferred embodiment, this is not a limitation of the presentinvention. If the electronic components 2 with seal materials are usedfor a purpose other than manufacturing of RFID tags, the electroniccomponents 5 may be components other than the RFIC elements. Forexample, the electronic components 5 may be sensor components, such astemperature sensors and acceleration sensors. In this case, a pluralityof sensor components with seal materials may be housed in a carriertape, and the carrier tape may be used to affix the sensor componentswith seal materials to articles that are an example of the connectionobject such as a carrying case. As a result, the plurality of the sensorcomponents are able to be mounted on articles at high speed.

Although the adhesive layer 4 a is provided on the one entire principalsurface of the seal material 4 in the first preferred embodiment, thisis not a limitation of the present invention. The adhesive layer 4 a maybe dispersedly or intermittently disposed at necessary positions on theone principal surface of the seal material 4.

A method for manufacturing a carrier tape according to the firstpreferred embodiment will be described. FIGS. 4A to 4E arecross-sectional views of an example of the method for manufacturing acarrier tape according to the first preferred embodiment.

First, as shown in FIG. 4A, the belt-shaped tape-shaped main body 3including a plurality of the housing holes 3 a along a longitudinaldirection is prepared.

As shown in FIG. 4B, the electronic components 5 are respectively housedinto the plurality of the housing holes 3 a of the tape-shaped main body3.

As shown in FIG. 4C, a tape-shaped seal material 4A including theadhesive layer 4 a on one principal surface is affixed to thetape-shaped main body 3, such that the adhesive layer 4 a covers thehousing holes 3 a and adheres to the electronic components 5.

As shown in FIG. 4D, cuts 4 c are provided in the tape-shaped sealmaterial 4A to separate portions defining and functioning as the sealmaterials 4 including portions overlapping with the respective housingholes 3 a in a planar view from the other portions 4 b. In this case,the cuts 4 c are provided to penetrate the tape-shaped seal material 4Afrom one principal surface to the other principal surface.

As shown in FIG. 4E, the other portions 4 b are separated from thetape-shaped main body 3. The other portions 4 b are connected in thelongitudinal direction of the tape-shaped seal material 4A and thereforeare able to be sequentially peeled off from the tape-shaped main body 3.

According to the method for manufacturing a carrier tape according tothe first preferred embodiment, the plurality of the electroniccomponents 2 with seal materials is housed in the carrier tape 1 and,therefore, the handleability of the plurality of the electroniccomponents 2 with seal materials is improved. Additionally, since theseal materials 4 necessary for manufacturing RFID tags are affixed tothe tape-shaped main body 3 to retain the electronic components 5, it isnot necessary to provide another member that is unnecessary formanufacturing RFID tags to retain the electronic components 5 in thehousing holes 3 a. Therefore, the number of manufacturing steps and themanufacturing costs are reduced.

In the method for manufacturing a carrier tape according to the firstpreferred embodiment, the cuts 4 c are formed in the tape-shaped sealmaterial 4A before separating the portions 4 b other than those definingand functioning as the seal materials 4 from the tape-shaped main body3. As a result, when the electronic components 2 with seal materials areseparated from the tape-shaped main body 3, the electronic components 2with seal materials are separated after the portions 4 b other thanthose defining and functioning as the seal materials 4 are removed, andtherefore, are able to be easily separated.

Although after the cuts 4 c are formed in the tape-shaped seal material4A, the portions 4 b other than those defining and functioning as theseal materials 4 are separated from the tape-shaped main body 3 in thefirst preferred embodiment, this is not a limitation of the presentinvention. The adhesion between the other portions 4 b and thetape-shaped main body 3, the size of the cuts 4 c, and other factors maybe adjusted such that when the electronic components 2 with sealmaterials are separated from the tape-shaped main body 3, the separationis not prevented by the portions 4 b other than those defining andfunctioning as the seal materials 4. This eliminates the need toseparate the other portions 4 b from the tape-shaped main body 3.

A method for manufacturing an RFID tag 10 according to a preferredembodiment of the present invention using the electronic component 2with a seal material (RFIC element 2 with a seal material) will bedescribed. FIG. 5 is a perspective view of the method for manufacturingthe RFID tag 10. FIG. 6 is a plan view of the antenna base material 11and the antenna element 12 that are components of the RFID tag 10. FIG.7 is a cross-sectional view taken along a line A2-A2 of FIG. 6. FIG. 8is a plan view of a state in which the electronic component 2 with aseal material is attached onto the antenna element 12. FIG. 9 is across-sectional view taken along a line A3-A3 of FIG. 8.

As shown in FIGS. 5 to 9, the RFID tag 10 is manufactured by attachingthe electronic component 2 with a seal material to the antenna element12 on one principal surface of the antenna base material 11. The RFIDtag 10 is, for example, an RFID tag using the 900 MHz band as acommunication frequency.

The antenna base material 11 preferably includes a flexible material,such as polyethylene terephthalate (PET) and paper, for example. Oneprincipal surface of the antenna base material 11 is provided with theantenna element 12 made of copper foil or aluminum foil.

The antenna element 12 preferably has a meandering shape, for example,and includes antenna conductors 12 a, 12 b defining and functioning as adipole antenna. A first end portion 12 aa and a second end portion 12 baare an end portion of the antenna conductor 12 a and an end portion ofthe antenna conductor 12 b, respectively, and are arranged so as to bespaced away from each other. An interval between the first end portion12 aa and the second end portion 12 ba is identical or substantiallyidentical to an interval between the first terminal electrode 5 a andthe second terminal electrode 5 b of the electronic component (RFICelement) 5.

The seal material 4 of the electronic component 2 with a seal materialis affixed by the adhesive layer 4 a to the antenna base material 11such that the first end portion 12 aa and the second end portion 12 baare brought into contact with the first terminal electrode 5 a and thesecond terminal electrode 5 b, respectively. As a result, the RFID tag10 is completed.

In this case, the first end portion 12 aa and the first terminalelectrode 5 a as well as the second end portion 12 ba and the secondterminal electrode 5 b are not directly fixed to each other but areelectrically connected to each other. Therefore, even when the antennabase material 11 is bent, the first end portion 12 aa and the firstterminal electrode 5 a as well as the second end portion 12 ba and thesecond terminal electrode 5 b slide at respective connection portionsand, therefore, no stress concentrates on the connection portions. Thus,degradation in the reliability of the connection is effectively reducedor prevented between the electronic component 2 with a seal material andthe antenna element 12.

Although the antenna conductors 12 a, 12 b preferably have a meanderingshape in the first preferred embodiment, this is not a limitation of thepresent invention. The antenna conductors 12 a, 12 b may have, forexample, a rectangular or substantially rectangular belt shape or othersuitable shapes. Although the antenna conductors 12 a, 12 b define andfunction as a dipole antenna, this is not a limitation of the presentinvention. The antenna conductors 12 a, 12 b may define and function asa loop type antenna or may define and function as other suitable typesof antennas.

A method for manufacturing a plurality of the RFID tags 10 according toa preferred embodiment of the present invention using the carrier tape 1will be described. FIG. 10 is a side view of an example of the methodfor manufacturing a plurality of the RFID tags 10 using the carrier tape1. FIG. 11 is an enlarged cross-sectional view of a portion surroundedby a dotted line of FIG. 10.

First, as shown in FIG. 10, a supply reel 21 is prepared with thecarrier tape 1 wound therearound. A plurality of the antenna basematerials 11 including the antenna elements 12 provided thereon as shownin FIG. 6 is connected in series and formed into a tape shape such thatthe sides in the transverse direction are connected to each other, and asupply reel 22 is prepared with the plurality of the antenna basematerials 11 wound therearound.

The carrier tape 1 is continuously pulled out from the supply reel 21while pulling out the antenna base materials 11 including the antennaelements 12 thereon from the supply reel 22, and the carrier tape 1 andthe antenna base materials 11 are brought into close proximity to eachother.

As shown in FIG. 11, the tape-shaped main body 3 of the carrier tape 1is folded (bent) in the vicinity of the antenna base materials 11 toseparate the electronic component 2 with a seal material from thetape-shaped main body 3. At the time of separation, while the electroniccomponent 2 with a seal material is being separated from the tape-shapedmain body 3, the electronic component 2 with a seal material is affixedto the antenna conductors 12 a, 12 b of the antenna element 12transported in the direction intersecting with the transport directionof the carrier tape 1.

More specifically, by folding the tape-shaped main body 3 of the carriertape 1 in the vicinity of the antenna base materials 11, one end portionof the seal material 4 first peels off from the tape-shaped main body 3.The one end portion of the seal material 4 adheres by the adhesive forceof the adhesive layer 4 a to the antenna conductor 12 b of the antennaelement 12 transported in the direction intersecting with the transportdirection of the carrier tape 1. Subsequently, as the carrier tape 1 andthe antenna element are further transported, the other end portion ofthe seal material 4 peels off from the tape-shaped main body 3. Theother end portion of the seal material 4 adheres by the adhesive forceof the adhesive layer 4 a to the antenna conductor 12 a of the antennaelement 12 transported in the direction intersecting with the transportdirection of the carrier tape 1. As a result, the RFID tag 10 shown inFIG. 8 is manufactured. By sequentially performing this operation, aplurality of RFID tags 10 are able to be manufactured.

According to the method for manufacturing an RFID tag according to thefirst preferred embodiment, the plurality of the electronic components 2with seal materials is housed in the carrier tape 1 and, therefore, thehandleability of the plurality of the electronic components 2 with sealmaterials is improved. Additionally, since the seal materials 4necessary for manufacturing the RFID tags 10 are affixed to thetape-shaped main body 3 to retain the electronic components 5, it is notnecessary to provide another member that is unnecessary formanufacturing the RFID tags 10 to retain the electronic components 5 inthe housing holes 3 a. Moreover, since the electronic components 2 withseal materials are able to be separated from the tape-shaped main body 3by simply folding the tape-shaped main body 3, the number ofmanufacturing steps and the manufacturing costs are reduced. An angle ofthe fold of the tape-shaped main body 3 and a degree of curvature at thefolded position may be appropriately set in consideration of theadhesive force between the electronic components 2 with seal materialsand the tape-shaped main body 3 and other factors.

In the method for manufacturing an RFID tag according to the firstpreferred embodiment, while the carrier tape 1 is continuously pulledout from the supply reel 21, the tape-shaped main body 3 of thepulled-out carrier tape 1 is folded at a certain position away from thesupply reel 21. As a result, the plurality of the electronic components2 with seal materials is sequentially separated from the tape-shapedmain body 3 and sequentially affixed to the antenna conductors 12 a, 12b of the antenna elements 12 pulled out from the supply reel 22.Therefore, for example, the carrier tape 1 is pulled out at a rate ofseveral dozen meters per minute to separate the plurality of theelectronic components 5 from the tape-shaped main body 3 at high speed.Consequently, a plurality of the RFID tags 10 are able to bemanufactured in shorter amount of time.

Preferably, the seal materials 4 have a shape (e.g., a rectangular orsubstantially rectangular shape) including a longitudinal direction anda transverse direction in a planar view and, when the electroniccomponents 2 with seal materials are each separated from the tape-shapedmain body 3, a portion in the longitudinal direction of the sealmaterial 4 is first separated. As a result, the electronic components 2with seal materials are able to be more easily separated from thetape-shaped main body 3.

The seal materials 4 preferably have higher rigidity than thetape-shaped main body 3. As a result, when the tape-shaped main body 3is folded, the separation of the seal materials 4 from the tape-shapedmain body 3 is facilitated. Therefore, the seal materials 4 arepreferably made of a material having a quality or a property associatedwith a larger elastic force (resilience), such as a larger Young'smodulus and a greater thickness, than the tape-shaped main body 3.

The carrier tape 1 after the separation of the electronic components 2with seal materials may be wound around a winding reel (not shown). Inparticular, the carrier tape 1 may preferably be transported by aroll-to-roll technique. Similarly, the antenna base materials 11including the antenna elements 12 thereon may preferably be transportedby a roll-to-roll technique.

In the example of manufacturing shown in FIGS. 10 and 11, although theelectronic components 2 with seal materials separated from thetape-shaped main body 3 are directly affixed to the antenna conductors12 a, 12 b, this is not a limitation of the present invention. Forexample, as shown in FIGS. 12 and 13, the electronic components 2 withseal materials separated from the tape-shaped main body 3 may be affixedto the antenna conductors 12 a, 12 b by using a conveyer 23.

More specifically, the carrier tape 1 pulled out from the supply reel 21is folded at a certain position away from the supply reel 21 to separatethe electronic component 2 with a seal material from the tape-shapedmain body 3. The separated electronic component 2 with a seal materialis conveyed by the conveyer 23 to the vicinity of the antenna basematerial 11 including the antenna element 12 thereon pulled out from thesupply reel 22. As a result, the one end portion of the seal material 4of the electronic component 2 with a seal material is affixed to theantenna conductor 12 b, and the other end portion of the seal material 4is affixed to the antenna conductor 12 a. By sequentially performingthis operation, a plurality of the RFID tags 10 are able to bemanufactured.

According to this configuration, the adjustment of machinery isfacilitated and the electronic components 2 with seal materials are ableto be more accurately affixed to the antenna conductors 12 a, 12 b. Tofold the carrier tape 1 and the antenna base materials 11, for example,rollers may be disposed at corresponding folding portions and thecarrier tape 1 and the antenna base materials 11 may be transportedalong the rollers.

The conveyer 23 may be an apparatus, such as a suction head, instead ofa belt-conveyor-type apparatus as shown in FIGS. 12 and 13. Inparticular, the electronic component 5 with a seal material separatedfrom the tape-shaped main body 3 may be sucked by a suction head andaffixed to the antenna conductors 12 a, 12 b of the antenna element 12.

Description will be made of a specific configuration of an RFIC element100 that is an example of the electronic component 5.

FIG. 14 is a perspective view of the RFIC element 100. The RFIC element100 is preferably an RFIC element corresponding to a communicationfrequency of, for example, the 900 MHz band, i.e., the UHF band. TheRFIC element 100 includes a multilayer substrate 120 with a principalsurface defining a rectangle or a substantial rectangle. The multilayersubstrate 120 has flexibility. For example, the multilayer substrate 120has a structure of a laminated body acquired by laminating flexibleresin insulation layers of polyimide, liquid crystal polymer or othersuitable materials. The insulation layers made of these materials have apermittivity that is smaller than that of ceramic base material layersrepresented by LTCC.

Hereinafter, for convenience of description, a longitudinal direction ofthe multilayer substrate 120 is indicated by an X-axis, a widthdirection of the multilayer substrate 120 is indicated by a Y-axis, anda thickness direction of the multilayer substrate 120 is indicated by aZ-axis.

FIG. 15 is a cross-sectional view of the RFIC element shown in FIG. 14taken along a line X1-X1. FIG. 16A is a plan view of an upper insulationlayer of the multilayer substrate 120 viewed from directly above. FIG.16B is a plan view of an intermediate insulation layer of the multilayersubstrate 120 viewed from directly above. FIG. 16C is a plan view of alower insulation layer of the multilayer substrate 120 viewed fromdirectly above. FIG. 17A is a cross-sectional view of the insulationlayer shown in FIG. 16A taken along a line B1-B1. FIG. 17B is across-sectional view of the insulation layer shown in FIG. 16B takenalong a line B2-B2. FIG. 17C is a cross-sectional view of the insulationlayer shown in FIG. 16C taken along a line B3-B3.

As shown in FIG. 15, an RFIC chip 160 and a power feeding circuit 180are included in the multilayer substrate 120. A first terminal electrode140 a and a second terminal electrode 140 b are provided on oneprincipal surface of the multilayer substrate 120.

The RFIC chip 160 includes various elements that are built into a hardsemiconductor substrate made of a semiconductor such as silicon, forexample. Both principal surfaces of the RFIC chip 160 are preferablysquare or substantially square, for example. As shown in FIG. 16C, afirst input/output terminal 160 a and a second input/output terminal 160b are provided on the other principal surface of the RFIC chip 160. TheRFIC chip 160 is located at the center or approximate center in each ofthe X-, Y-, and Z-axes inside the multilayer substrate 120 and arrangedsuch that the sides of the square extend along the X-axis or the Y-axisand the one principal surface and the other principal surface face thepositive side and the negative side, respectively, in the Z-axisdirection.

The power feeding circuit 180 includes a coil conductor 200 andinterlayer connection conductors 240 a, 240 b. The coil conductor 200includes coil patterns 200 a to 200 c shown in FIG. 16B or 16C. Aportion of the coil pattern 200 a includes a first coil portion CIL1. Aportion of the coil pattern 200 b includes a second coil portion CIL2.Portions of the coil pattern 200 c include a third coil portion CIL3 anda fourth coil portion CIL4.

The first coil portion CIL1, the third coil portion CIL3, and theinterlayer connection conductor 240 a are arranged in the Z-axisdirection at positions on the negative side in the X-axis direction. Thesecond coil portion CIL2, the fourth coil portion CIL4, and theinterlayer connection conductor 240 b are arranged in the Z-axisdirection at positions on the positive side in the X-axis direction.

When the multilayer substrate 120 is viewed in the Z-axis direction, theRFIC chip 160 is located between the first coil portion CIL1 and thesecond coil portion CIL2. When the multilayer substrate 120 is viewed inthe Y-axis direction, the RFIC chip 160 is located between the thirdcoil portion CIL3 and the fourth coil portion CIL4.

The first terminal electrode 140 a is disposed at a position on thenegative side in the X-axis direction. The second terminal electrode 140b is disposed at a position on the positive side in the X-axisdirection. Both of the first terminal electrode 140 a and the secondterminal electrode 140 b are preferably made of flexible copper foilhaving a strip shape, for example. The first terminal electrode 140 aand the second terminal electrode 140 b preferably have principalsurface sizes that are identical or substantially identical to eachother. The short sides of the first terminal electrode 140 a and thesecond terminal electrode 140 b extend in the X-axis direction. The longsides of the first terminal electrode 140 a and the second terminalelectrode 140 b extend in the Y-axis direction.

Therefore, when the multilayer substrate 120 is viewed in the Y-axisdirection, the RFIC chip 160 is interposed between a portion of thepower feeding circuit 180 and another portion of the power feedingcircuit 180. When the multilayer substrate 120 is viewed in the X-axisdirection, the RFIC chip 160 overlaps with the power feeding circuit180. In a planar view of the multilayer substrate 120, the power feedingcircuit 180 at least partially overlaps with each of the first andsecond terminal electrodes 140 a, 140 b.

As shown in FIGS. 16A to 16C, the multilayer substrate 120 includesthree laminated sheet-shaped insulation layers 120 a to 120 c. Theinsulation layer 120 a is located at an upper position, the insulationlayer 120 b is located at an intermediate position, and the insulationlayer 120 c is located at a lower position.

The first terminal electrode 140 a and the second terminal electrode 140b are provided on one principal surface of the insulation layer 120 a.At the center or approximate center position of one principal surface ofthe insulation layer 120 b, a rectangular or substantially rectangularthrough-hole HL1 is provided, which extends to the other principalsurface. The through-hole HL1 preferably has a size sufficient toaccommodate the RFIC chip 160 therein. The coil pattern 200 c preferablyhaving a belt shape extends around the through-hole HL1 on the oneprincipal surface of the insulation layer 120 b. The coil pattern 200 cis preferably made of copper foil having flexibility.

One end portion of the coil pattern 200 c is disposed at a positionoverlapping with the first terminal electrode 140 a in the planar viewand is connected to the first terminal electrode 140 a by an interlayerconnection conductor 220 a extending in the Z-axis direction. The otherend portion of the coil pattern 200 c is disposed at a positionoverlapping with the second terminal electrode 140 b in the planar viewand is connected to the second terminal electrode 140 b by an interlayerconnection conductor 220 b extending in the Z-axis direction. Theinterlayer connection conductors 220 a, 220 b include hard metal massescontaining Sn as a main component.

Assuming that the one end portion of the coil pattern 200 c is astarting point, the coil pattern 200 c extends around the one endportion twice in the counterclockwise direction, extends to near the endportion of the negative side in the Y-axis direction, and then extendsinto the positive side in the X-axis direction. The coil pattern 200 cbends near the end portion of the positive side in the X-axis directiontoward the positive side in the Y-axis direction and extends around theother end portion twice in the counterclockwise direction beforereaching the other end portion.

The coil patterns 200 a, 200 b preferably having a belt shape areprovided on one principal surface of the insulation layer 120 c. Thecoil patterns 200 a, 200 b are preferably made of copper foil havingflexibility. In a planar view of the insulation layers 120 b, 120 c, oneend portion of the coil pattern 200 a is disposed at a position on thenegative side in the Y-axis direction as compared to the one end portionof the coil pattern 200 c. The other end portion of the coil pattern 200a (a first coil end T1) is disposed at a position overlapping with acorner portion on the negative side in the X-axis direction and thepositive side in the Y-axis direction out of the four corner portions ofthe rectangular through-hole HL1.

One end portion of the coil pattern 200 b is disposed at a position onthe negative side in the Y-axis direction as compared to the other endportion of the coil pattern 200 c. The other end portion of the coilpattern 200 b (a second coil end T2) is disposed at a positionoverlapping with a corner portion on the positive side in the X-axisdirection and the positive side in the Y-axis direction out of the fourcorner portions of the rectangular or substantially rectangularthrough-hole HL1. Both the first coil end T1 and the second coil end T2are rectangular or substantially rectangular in the planar view of theinsulation layer 120 c.

Assuming that the one end portion of the coil pattern 200 a is astarting point, the coil pattern 200 a extends around the one endportion about 2.5 times, for example, in the clockwise direction andsubsequently bends toward the negative side in the Y-axis direction toreach the other end portion. Similarly, assuming that the one endportion of the coil pattern 200 b is a starting point, the coil pattern200 b extends around the one end portion about 2.5 times, for example,in the counterclockwise direction and subsequently bends toward thenegative side in the Y-axis direction to reach the other end portion.The one end portion of the coil pattern 200 a is connected to the oneend portion of the coil pattern 200 c by the interlayer connectionconductor 240 a extending in the Z-axis direction. The one end portionof the coil pattern 200 b is connected to the other end portion of thecoil pattern 200 c by the interlayer connection conductor 240 bextending in the Z-axis direction. The interlayer connection conductors240 a, 240 b include hard metal masses containing Sn as a maincomponent.

In the planar view of the insulation layers 120 b, 120 c, a section ofthe coil pattern 200 a overlaps with a section of the coil pattern 200c, and a section of the coil pattern 200 b overlaps with another sectionof the coil pattern 200 c. Between the overlapping sections of the coilpatterns 200 a, 200 c, the section of the coil pattern 200 a is definedas a “first coil portion CIL1” and the section of the coil pattern 200 cis defined as a “third coil portion CIL3.” Between the overlappingsections of the coil patterns 200 b, 200 c, the section of the coilpattern 200 b is defined as a “second coil portion CIL2” and the sectionof the coil pattern 200 c is defined as a “fourth coil portion CIL4.”The position of the one end portion of the coil pattern 200 a or the oneend portion of the coil pattern 200 c is defined as a “first positionP1” and the position of the one end portion of the coil pattern 200 b orthe other end portion of the coil pattern 200 c is defined as a “secondposition P2.”

Rectangular or substantially rectangular dummy conductors 260 a, 260 bare provided on the one principal surface of the insulation layer 120 c.The dummy conductors 260 a, 260 b are preferably made of copper foilhaving flexibility. In the planar view of the insulation layers 120 b,120 c, the dummy conductors 260 a, 260 b are disposed to overlap withtwo respective corner portions arranged in the X-axis direction on thenegative side in the Y-axis direction out of the four corner portions ofthe rectangular or substantially rectangular through-hole HL1.

The RFIC chip 160 is mounted on the insulation layer 120 c such that thefour corner portions of the other principal surface respectively facethe first coil end T1, the second coil end T2, and the dummy conductors260 a, 260 b. The first input/output terminal 160 a is disposed on theother principal surface of the RFIC chip 160 to overlap with the firstcoil end T1 in the planar view. Similarly, the second input/outputterminal 160 b is disposed on the other principal surface of the RFICchip 160 to overlap with the second coil end T2 in the planar view.

As a result, the RFIC chip 160 is connected to the first coil end T1 bythe first input/output terminal 160 a and is connected to the secondcoil end T2 by the second input/output terminal 160 b.

The thickness of the insulation layers 120 a to 120 c is preferably isabout 10 μm or greater and about 100 μm or less, for example. Therefore,the RFIC chip 160 and the power feeding circuit 180 built into themultilayer substrate 120 can be seen through on the outside. Therefore,the connection state, i.e., presence of a broken wire, of the RFIC chip160 and the power feeding circuit 180 is easily confirmed.

FIG. 18 is a diagram of an equivalent circuit of the RFIC element 100configured as described above. In FIG. 18, an inductor L1 corresponds tothe first coil portion CIL1. An inductor L2 corresponds to the secondcoil portion CIL2. An inductor L3 corresponds to the third coil portionCIL3. An inductor L4 corresponds to the fourth coil portion CIL4. Theimpedance matching characteristics by the power feeding circuit 180 arespecified by the values of the inductors L1 to L4.

One end portion of the inductor L1 is connected to the firstinput/output terminal 160 a disposed on the RFIC chip 160. One endportion of the inductor L2 is connected to the second input/outputterminal 160 b disposed on the RFIC chip 160. The other end portion ofthe inductor L1 is connected to one end portion of the inductor L3. Theother end portion of the inductor L2 is connected to one end portion ofthe inductor L4. The other end portion of the inductor L3 is connectedto the other end portion of the inductor L4. The first terminalelectrode 140 a is connected to a connection point between the inductorsL1, L3. The second terminal electrode 140 b is connected to a connectionpoint between the inductors L2, L4.

As can be seen from the equivalent circuit shown in FIG. 18, the firstcoil portion CIL1, the second coil portion CIL2, the third coil portionCIL3, and the fourth coil portion CIL4 are wound so as to providemagnetic fields that are in phase and are connected in series to eachother. Therefore, the magnetic fields are generated towards a directionindicted by arrows of FIG. 19 at a certain point in time. On the otherhand, the magnetic fields are generated towards a direction opposite tothe direction indicted by the arrows of FIG. 19 at another point intime.

As can be seen from FIGS. 16B and 16C, the first coil portion CIL1 andthe third coil portion CIL3 preferably have the same or substantiallythe same loop shape and a same first winding axis. Similarly, the secondcoil portion CIL2 and the fourth coil portion CIL4 preferably have thesame or substantially the same loop shape and a same second windingaxis. The first winding axis and the second winding axis are disposed atpositions such that the RFIC chip 160 is interposed therebetween.

Therefore, the first coil portion CIL1 and the third coil portion CIL3are magnetically and capacitively coupled. Similarly, the second coilportion CIL2 and the fourth coil portion CIL4 are magnetically andcapacitively coupled.

As is understood from the description, the RFIC chip 160 includes thefirst input/output terminal 160 a and the second input/output terminal160 b and is built into the multilayer substrate 120. The power feedingcircuit 180 includes the coil patterns 200 a to 200 c and is built intothe multilayer substrate 120. Among these, the other end portion of thecoil pattern 200 a (the first coil end T1) is connected to the firstinput/output terminal 160 a, and the other end portion of the coilpattern 200 b (the second coil end T2) is connected to the secondinput/output terminal 160 b. The first terminal electrode 140 a and thesecond terminal electrode 140 b are disposed on the one principalsurface of the multilayer substrate 120. The first terminal electrode140 a is connected to the one end portion of the coil pattern 200 a (thefirst position P1). The second terminal electrode 140 b is connected tothe one end portion of the coil pattern 200 b (the second position P2).

The first coil portion CIL1 is located in a section from the first coilend T1 to the first position P1 and includes the first winding axis in adirection intersecting with the one principal surface of the multilayersubstrate 120. The second coil portion CIL2 is located in a section fromthe second coil end T2 to the second position P2 and includes the secondwinding axis in a direction intersecting with the one principal surfaceof the multilayer substrate 120. The third coil portion CIL3 is disposedso as to overlap with the first coil portion CIL1 in the planar view.The fourth coil portion CIL4 is disposed so as to overlap with thesecond coil portion CIL2 in the planar view. The first coil portionCIL1/the third coil portion CIL3 and the second coil portion CIL2/thefourth coil portion CIL4 are disposed at locations such that the RFICchip 160 is interposed therebetween. The multilayer substrate 120includes the power feeding circuit 180 that preforms impedance matchingbetween the antenna element 12 and the RFIC chip 160 as well as thebuilt-in RFIC chip 160.

The RFIC chip 160 includes the semiconductor substrate. Therefore, theRFIC chip 160 acts as a ground or as a shield for the first coil portionCIL1, the second coil portion CIL2, the third coil portion CIL3, and thefourth coil portion CIL4. Consequently, the first coil portion CIL1 andthe second coil portion CIL2 as well as the third coil portion CIL3 andthe fourth coil portion CIL4 are not significantly magnetically orcapacitively coupled to each other. This reduces the risk of narrowingthe passband of communication signals.

An example of attaching the RFIC element 100 onto the antenna conductors12 a, 12 b by conductive bonding materials 13 a, 13 b will be described.FIG. 20 is a diagram of the distribution of rigid and flexible regionsin the RFIC element 100. FIG. 21 is a diagram of a bent state of an RFIDtag including the RFIC element 100 attached to the antenna conductors 12a, 12 b.

As described above, the multilayer substrate 120, the coil patterns 200a to 200 c, the first terminal electrode 140 a, and the second terminalelectrode 140 b include members having flexibility. On the other hand,the interlayer connection conductors 220 a, 220 b, 240 a, 240 b and theRFIC chip 160 include hard, rigid members. The first terminal electrode140 a and the second terminal electrode 140 b have a comparatively largesize and, therefore, are less flexible. If a plating film of Ni/Au orNi/Sn is applied to the first terminal electrode 140 a and the secondterminal electrode 140 b, the first terminal electrode 140 a and thesecond terminal electrode 140 b are further reduced in flexibility.

As a result, rigid regions and flexible regions are provided in the RFICelement 100 as shown in FIG. 20. More specifically, the regionsincluding the first terminal electrode 140 a, the second terminalelectrode 140 b, and the RFIC chip 160 are defined as the rigid regions,and the other regions are defined as the flexible regions. Particularly,since the first terminal electrode 140 a and the second terminalelectrode 140 b are disposed at positions spaced away from the RFIC chip160, the flexible regions are located between the first terminalelectrode 140 a and the RFIC chip 160 and between the second terminalelectrode 140 b and the RFIC chip 160.

Therefore, if the RFID tag including the RFIC element 100 affixed to theantenna conductors 12 a, 12 b of the antenna base material 11 is affixedto a curved surface, the RFIC element 100 is bent as shown in FIG. 21,for example.

FIG. 22 is a diagram of an example in which a current flows through anequivalent circuit of the RFID tag of FIG. 21. FIG. 23 is a graph of anexample of resonance frequency characteristics of the RFID tag of FIG.21.

As shown in FIG. 22, the RFIC chip 160 itself has a parasiticcapacitance (stray capacitance) Cp between the first input/outputterminal 160 a and the second input/output terminal 160 b. Therefore,two resonances are generated in the RFIC element 100. The firstresonance is the resonance generated in a current path including theantenna conductors 12 a, 12 b and the inductors L3, L4. The secondresonance is the resonance generated in a current path (current loop)including the inductors L1 to L4 and the parasitic capacitance Cp. Thesetwo resonances are coupled by the inductors L3 to L4 which are shared bythe current paths. Two respective currents I1 and I2 corresponding tothe two resonances flow as indicated by a dotted line in FIG. 22.

Both of a first resonance frequency and a second resonance frequency areaffected by the inductors L3 to L4. A difference of several dozen MHz,and more specifically, about 5 MHz or more to about 50 MHz or less, forexample, is generated between the first resonance frequency and thesecond resonance frequency. The resonance frequency characteristicsthereof are represented by curves I and II in FIG. 23. By combining thetwo resonances having such resonance frequencies, broadband resonancefrequency characteristics are produced as indicated by a curve III inFIG. 23.

Second Preferred Embodiment

FIG. 24 is a perspective view of a general configuration of anelectronic component 2A with a seal material according to a secondpreferred embodiment of the present invention. FIG. 25 is a plan view ofthe electronic component 2A with a seal material of FIG. 24 attached tothe antenna element 12 of the antenna base material 11. The secondpreferred embodiment is different from the first preferred embodiment inthat a seal material 41 of the electronic component 2A with a sealmaterial has a smaller size than the seal material 4.

As shown in FIG. 24, the seal material 41 preferably has a rectangularor substantially rectangular belt shape. The seal material 41 isattached to a portion of the fixation surface of the electroniccomponent 5 to extend in a direction intersecting with, e.g.,perpendicular or substantially perpendicular to, the longitudinaldirection of the electronic component 5.

The seal material 41 also ensures the electric connection between theterminal electrodes 5 a, 5 b of the electronic component 5 and theantenna conductors 12 a, 12 b, and eliminates the need for directfixation using ultrasonic bonding or fixation using a bonding material.

The seal material 41 is able to be manufactured using the manufacturingsteps for the carrier tape described above with reference to FIG. 4D byforming cuts to separate a portion defining and functioning as the sealmaterial 41 including a portion partially overlapping with each of thehousing holes 3 a in a planar view from the other portions. FIG. 26 is abottom view of a state in which the portions other than those definingand functioning as the seal materials 41 are separated from thetape-shaped main body 3 after the formation of the cuts. In this case,the seal materials 41 do not completely cover the housing holes 3 a,such that portions of the housing holes 3 a are exposed.

Although one seal material 41 is preferably provided for each of theelectronic components 5 in the second preferred embodiment, this is nota limitation of the present invention. For example, two or more sealmaterials 41 may be provided for each of the electronic components 5.

Third Preferred Embodiment

FIG. 27 is a perspective view of a general configuration of anelectronic component 2B with a seal material according to a thirdpreferred embodiment of the present invention. FIG. 28 is a plan view ofthe electronic component 2B with a seal material of FIG. 27 attached toan antenna element 12B of an antenna base material 11B. The thirdpreferred embodiment is different from the first preferred embodiment inthat a seal material 42 of the electronic component 2B with a sealmaterial has a smaller width than the seal material 4 and the antennaconductors 12 aB, 12 bB of the antenna element 12B preferably have anelongated rectangular or substantially rectangular belt shape.

As shown in FIG. 27, the seal material 42 is attached to the fixationsurface of the electronic component 5 to extend in the longitudinaldirection of the electronic component 5. The length of the seal material42 in the transverse direction and the length of the electroniccomponent 5 in the transverse direction are preferably the same orsubstantially the same. The seal material 42 has a length in thelongitudinal direction that is longer than the length of the electroniccomponent 5 in the longitudinal direction and is sized to protrude fromboth end portions of the electronic component 5 in the longitudinaldirection.

The seal material 42 shaped and sized as described above also ensuresthe electric connection between the terminal electrodes 5 a, 5 b of theelectronic component 5 and the antenna conductors 12 a, 12 b, andeliminates the need for direct fixation using ultrasonic bonding orfixation using a bonding material. Since the width of the electroniccomponent 2B with a seal material is able to be reduced, the widths ofthe antenna base material 11B and the antenna conductors 12 aB, 12 bB ofthe antenna element 12B are able to be narrowed such that, for example,the component is able to be affixed to an outer circumferential surfaceof a circular plate-shaped disk such as a DVD.

In the third preferred embodiment, the antenna element 12B defines andfunctions as a dipole antenna. The antenna conductors 12 aB, 12 bB havecommon or substantially common widths and lengths. The width of theantenna conductors 12 aB, 12 bB is smaller than the width of the antennabase material 11B. The width of the antenna base material 11B ispreferably about 1 mm, for example. The length of the antenna conductors12 aB, 12 bB is preferably less than half of the length of the antennabase material 11B.

The seal material 42 is able to be manufactured in the manufacturingsteps for the carrier tape described above with reference to FIG. 4D byforming cuts to separate a portion defining and functioning as the sealmaterial 42 including a portion partially overlapping with each of thehousing holes 3 a in a planar view from the other portions. FIG. 29 is abottom view of a state in which the portions other than those definingand functioning as the seal materials 42 are separated from thetape-shaped main body 3 after the formation of the cuts. In this case,the seal materials 42 do not completely cover the housing holes 3 a,such that portions of the housing holes 3 a are exposed.

Fourth Preferred Embodiment

FIG. 30 is a cross-sectional view of a general configuration of acarrier tape 1A according to a fourth preferred embodiment of thepresent invention. The fourth preferred embodiment is different from thefirst preferred embodiment in that the depth of the housing holes 3 a isless than the thickness of the electronic components 5, that theelectronic components 5 project upward from the housing holes 3 a, andthat the seal materials 4 are curved at portions corresponding to thehousing holes 3 a.

According to this configuration, the seal materials 4 and the electroniccomponents 5 are able to be more certainly brought into contact witheach other, and the seal materials 4 and the electronic components 5 areable to be more securely bonded through the adhesive layers 4 a. If thedepth of the housing holes 3 a is greater than the thickness of theelectronic components 5, the seal materials 4 cannot contact theelectronic components 5 unless the seal materials 4 enter into thehousing holes 3 a. Therefore, the electronic components 5 and the sealmaterials 4 may be unable to be bonded to one another or the adhesiveforce therebetween may be reduced.

Fifth Preferred Embodiment

FIG. 31 is a cross-sectional view of a general configuration of acarrier tape 1B according to a fifth preferred embodiment of the presentinvention. The fifth preferred embodiment is different from the firstpreferred embodiment in that the depth of the housing holes 3 a is lessthan the thickness of the electronic components 5, that the electroniccomponents 5 project upward and downward from the housing holes 3 a, andthat the seal materials 4 and the tape-shaped main body 3 are curved atportions corresponding to the housing holes 3 a. Therefore, thetape-shaped main body 3 has an embossed tape configuration.

According to this configuration, as is the case with the fourthpreferred embodiment described above, the seal materials 4 and theelectronic components 5 are able to be more certainly brought intocontact with each other, and the seal materials 4 and the electroniccomponents 5 are able to be more securely bonded through the adhesivelayers 4 a. Since the tape-shaped main body 3 is also curved at theportions corresponding to the housing holes 3 a, the pressure appliedfrom the electronic components 5 to the seal materials 4 are reduced sothat the seal materials 4 are prevented from peeling from thetape-shaped main body 3 due to the pressure.

Sixth Preferred Embodiment

FIG. 32 is a plan view of a general configuration of a carrier tapeaccording to a sixth preferred embodiment of the present invention. FIG.33 is a cross-sectional view taken along a line C1-C1 of FIG. 32. FIG.34 is a perspective view of a general configuration of the electroniccomponent with a seal material.

As shown in FIGS. 32 and 33, a carrier tape 31 according to the sixthpreferred embodiment 6 is configured to house a plurality of electroniccomponents 32 with seal materials. More specifically, the carrier tape31 includes a tape-shaped main body 33, a plurality of seal materials34, and a plurality of chip-shaped electronic components 35. Theelectronic components 32 with seal materials include the seal materials34 and the electronic components 35.

The tape-shaped main body 33 is preferably a belt-shaped member thatincludes a plurality of housing holes 33 a including a bottom surface onone principal surface. The plurality of the housing holes 33 a isdisposed along the longitudinal direction of the tape-shaped main body33. The arrangement intervals of the housing holes 33 a are preferablyequal or substantially equal intervals, for example. The housing holes33 a have a size that is slightly larger than the electronic components35 so that the electronic components 35 are entirely housed in a planarview while a gap of about 0.1 mm to about 2 mm, for example, ispreferably provided around the electronic components 5. The “planarview” in this case refers to a view in the direction shown in FIG. 32.The tape-shaped main body 33 includes a member having a heat resistanceproperty and flexibility, for example. The thickness of the tape-shapedmain body 33 is preferably about 50 μm to about 800 μm, for example. Inthe sixth preferred embodiment, the depth of the housing holes 33 a isthe same or substantially the same as the thickness of the electroniccomponents 35 or shallower than the thickness of the electroniccomponents 35. Both end portions in the width direction of thetape-shaped main body 3 are provided with a plurality of feed holes 33 dalong the longitudinal direction of the tape-shaped main body 33.Suction holes may be provided for temporarily sucking and fixing theelectronic components 35 until the electronic components 35 are fixed bythe seal materials 34 after disposing the electronic components 35 inthe bottom portions of the housing holes 33 a.

The seal materials 34 are each affixed to, for example, an antenna basematerial 51, described later, to retain electrical connection between anantenna element 52 that is an example of a connection object, and theelectronic component 35. Each of the seal materials 34 includes anadhesive layer 34 a on one principal surface. The adhesive layer 34 a ispreferably provided on the entire or substantially the entire oneprincipal surface of the seal material 34, for example. The sealmaterials 34 are affixed to one principal surface of the tape-shapedmain body 33 such that the adhesive layers 34 a are exposed in thehousing holes 33 a. The one principal surface of the tape-shaped mainbody 33 is subjected to a release treatment. In the sixth preferredembodiment, the seal materials 34 preferably have a larger size than thehousing holes 33 a so as to completely cover the housing holes 33 a. Theseal materials 34 preferably include members having a heat resistanceproperty, flexibility, and elasticity, such as polyimide, for example.The thickness of the seal materials 34 is preferably about 20 μm toabout 200 μm, for example.

The electronic components 35 are housed in the housing holes 33 a andbonded to the adhesive layers 34 a of the seal materials 34. As shown inFIG. 34, each of the electronic components 35 includes a pair ofterminal electrodes 35 a, 35 b. The pair of the terminal electrodes 35a, 35 b electrically connects a chip-shaped main body 35 c of theelectronic component 35 and the antenna element 52, and is fixed to thechip-shaped main body 35 c of the electronic component 35 and bonded tothe adhesive layer 34 a. The pair of the terminal electrodes 35 a, 35 bis preferably made of, for example, copper foil, so that the electrodesare bonded with solder to the chip-shaped main body 35 c of theelectronic component 35. The one terminal electrode 35 a and the otherterminal electrode 35 b are arranged so as to face each other with a gaptherebetween. For example, the electronic component 35 is able to bemanufactured by punching a hoop material to form a pair of the terminalelectrodes 35 a, 35 b and by soldering the chip-shaped main body 35 cstraddling the end portions facing each other of the pair of theterminal electrodes 35 a, 35 b before removal from the hoop material.

In the sixth preferred embodiment, the chip-shaped main bodies 35 c ofthe electronic components 35 are preferably RFIC elements, such aspackages or straps with RFIC chips sealed therein, for example. The RFICelements are preferably ultrathin packages, for example. The height(thickness) of the RFIC elements is preferably about 50 μm to about 1mm, for example.

In the carrier tape according to the sixth preferred embodiment, theplurality of the electronic components 32 with seal materials is housedin the carrier tape 31 and, therefore, the handleability of theplurality of the electronic components 32 with seal materials isimproved. Additionally, since the seal materials 34 for manufacturingRFID tags are affixed to the tape-shaped main body 33 to retain theelectronic components 35, it is not necessary to provide another memberthat is unnecessary for manufacturing RFID tags to retain the electroniccomponents 35 in the housing holes 33 a. Therefore, the numbermanufacturing steps and the manufacturing costs are reduced.

Although the chip-shaped main bodies 35 c of the electronic components35 are RFIC elements in the sixth preferred embodiment, this is not alimitation of the present invention. If the electronic components 32with seal materials are used for a purpose other than the manufacturingof RFID tags, the chip-shaped main bodies 35 c of the electroniccomponents 35 may be components other than the RFIC elements. Forexample, the chip-shaped main bodies 35 c of the electronic components35 may be sensor components, such as temperature sensors andacceleration sensors. In this case, a plurality of sensor componentswith seal materials may be housed in a carrier tape, and the carriertape may be used for affixing the sensor components with seal materialsto articles that are an example of the connection object such as acarrying case. As a result, the plurality of the sensor components ismounted on articles at high speed.

Although the adhesive layer 34 a is provided on the entire orsubstantially the entire one principal surface of the seal material 34in the sixth preferred embodiment, this is not a limitation of thepresent invention. The adhesive layer 34 a may be dispersedly orintermittently disposed at necessary positions on the one principalsurface of the seal material 34.

Although a pair of the terminal electrodes 35 a, 35 b is provided on theadhesive layer 34 a of the seal material 34 and the chip-shaped mainbody 35 c is provided on the pair of the terminal electrodes 35 a, 35 bin the sixth preferred embodiment, this is not a limitation of thepresent invention. For example, as shown in FIG. 35, the chip-shapedmain body 35 c may be provided on the adhesive layer 34 a of the sealmaterial 34, and a pair of the terminal electrodes 35 a, 35 b may beprovided to straddle a principal surface of the chip-shaped main body 35c and the adhesive layer 34 a.

A method for manufacturing a carrier tape according to the sixthpreferred embodiment will be described. FIGS. 36A to 36E are perspectiveviews of a non-limiting example of the method for manufacturing acarrier tape according to the sixth preferred embodiment.

First, as shown in FIG. 36A, the tape-shaped main body including aplurality of the housing holes 33 a along a longitudinal direction isprepared.

As shown in FIG. 36B, the electronic components 35 are respectivelyhoused in the plurality of the housing holes 33 a of the tape-shapedmain body 33.

As shown in FIG. 36C, a tape-shaped seal material 34A including theadhesive layer 34 a on one principal surface is affixed to thetape-shaped main body 33 such that the adhesive layer 34 a covers thehousing holes 33 a and adheres to pairs of the terminal electrodes 35 a,35 b of the electronic components 35.

As shown in FIG. 36D, cuts 34 c are formed in the tape-shaped sealmaterial 34A to separate portions thereof that define and function asthe seal materials 34 including portions overlapping with the respectivehousing holes 33 a in a planar view from the other portions 34 b. Inthis case, the cuts 34 c are formed to penetrate the tape-shaped sealmaterial 34A and reach the one principal surface of the tape-shaped mainbody 33.

As shown in FIG. 36E, the other portions 34 b are separated from thetape-shaped main body 33. The other portions 34 b are connected in thelongitudinal direction of the tape-shaped seal material 34A and,therefore, are able to be sequentially peeled off from the tape-shapedmain body 33.

According to the method for manufacturing a carrier tape according tothe sixth preferred embodiment, the plurality of the electroniccomponents 32 with seal materials is housed in the carrier tape 31 and,therefore, the handleability of the plurality of the electroniccomponents 32 with seal materials is improved. Additionally, since theseal materials 34 necessary for manufacturing RFID tags are affixed tothe tape-shaped main body 33 to retain the electronic components 35, itis not necessary to provide another member that is unnecessary formanufacturing RFID tags to retain the electronic components 35 in thehousing holes 33 a. Therefore, the number of manufacturing steps and themanufacturing costs are reduced.

In a method for manufacturing a carrier tape according to the sixthpreferred embodiment, the cuts 34 c are formed in the tape-shaped sealmaterial 34A before separating the portions 34 b other than thosedefining and functioning as the seal materials 34 from the tape-shapedmain body 33. As a result, when the electronic components 32 with sealmaterials are separated from the tape-shaped main body 33, theelectronic components 32 with seal materials are separated after theportions 34 b other than those defining and functioning as the sealmaterials 34 are removed, and therefore are able to be easily separated.

Although after the cuts 34 c are formed in the tape-shaped seal material34A, the portions 34 b other than those defining and functioning as theseal materials 34 are separated from the tape-shaped main body 33 in thesixth preferred embodiment, this is not a limitation of the presentinvention. The adhesion between the other portions 34 b and thetape-shaped main body 33, the size of the cuts 34 c, and other factorsmay be adjusted such that when the electronic components 32 with sealmaterials are separated from the tape-shaped main body 33, theseparation is not prevented by the portions 34 b other than thosedefining and functioning as the seal materials 34. This eliminates theneed to separate the other portions 34 b from the tape-shaped main body33.

A method for manufacturing an RFID tag 50 according to a preferredembodiment of the present invention using the electronic component 32with a seal material (RFIC element 32 with a seal material) will bedescribed. FIG. 37 is a perspective view of the method for manufacturingthe RFID tag 50. FIG. 38 is a plan view of the antenna base material 51and the antenna element 52 that are components of the RFID tag 50. FIG.39 is a cross-sectional view taken along a line C2-C2 of FIG. 38. FIG.40 is a plan view of a state in which the electronic component 32 with aseal material is attached onto the antenna element 52. FIG. 41 is across-sectional view taken along a line C3-C3 of FIG. 40.

As shown in FIGS. 37 to 41, the RFID tag 40 is manufactured by attachingthe electronic component 32 with a seal material to the antenna element52 provided on one principal surface of the antenna base material 51.Preferably, the RFID tag 50 is, for example, an RFID tag using the 900MHz band as a communication frequency.

The antenna base material 51 is preferably made of a flexible material,such as polyethylene terephthalate (PET) and paper, for example. Oneprincipal surface is provided with the antenna element 52 preferablymade of copper foil or aluminum foil or silver paste, for example.

The antenna element 52 includes antenna conductors 52 a, 52 b having ameandering shape, for example, and acting as a dipole antenna. A firstend portion 52 aa and a second end portion 52 ba are an end portion ofthe antenna conductor 52 a and an end portion of the antenna conductor52 b, respectively, and are spaced away from each other. An intervalbetween the first end portion 52 aa and the second end portion 52 ba ispreferably identical or substantially identical to an interval of a pairof the terminal electrodes 35 a, 35 b.

The seal material 34 of the electronic component 32 with a seal materialis affixed by the adhesive layer 34 a to the antenna base material 51such that the first end portion 52 aa and the second end portion 52 baare brought into contact with the one terminal electrode 35 a and theother terminal electrode 35 b, respectively. As a result, the RFID tag50 is completed as shown in FIGS. 40 and 41. In this case, the first endportion 52 aa and the one terminal electrode 35 a as well as the secondend portion 52 ba and the other terminal electrode 35 b are brought intodirect contact with each other without the adhesive layer 34 atherebetween.

Although the antenna conductors 52 a, 52 b preferably have a meanderingshape in the sixth preferred embodiment, this is not a limitation of thepresent invention. The antenna conductors 52 a, 52 b may have, forexample, a rectangular or substantially belt shape or other suitableshapes. Although the antenna conductors 52 a, 52 b define and functionas a dipole antenna, this is not a limitation of the present invention.The antenna conductors 52 a, 52 b may define and function as a loop typeantenna or may define and function as other types of antennas. Theantenna element 52 may define and function as a spiral-shaped antenna asshown in FIG. 42. In this case, for example, the antenna element 52 maybe covered with a resist film except for the first end portion 52 aa andthe second end portion 52 ba, so as to connect the first end portion 52aa and the one terminal electrode 35 a as well as the second end portion52 ba and the other terminal electrode 35 b to each other.

A method for manufacturing a plurality of the RFID tags 50 according toa preferred embodiment of the present invention using the carrier tape31 will be described. FIG. 43 is a side view of an example of the methodfor manufacturing a plurality of the RFID tags 50 by using the carriertape 31. FIG. 44 is an enlarged cross-sectional view of a portionsurrounded by a dotted line of FIG. 43.

First, as shown in FIG. 43, a supply reel 61 is prepared with thecarrier tape 31 wound therearound. A plurality of the antenna basematerials 51 including the antenna elements 52 thereon as shown in FIG.38 is connected in series and into a tape shape such that the sides inthe longitudinal direction are connected to each other, and a supplyreel 62 is prepared with the plurality of the antenna base materials 51wound therearound.

The carrier tape 31 is continuously pulled out from the supply reel 61while pulling out the antenna base materials 51 including the antennaelements 52 thereon from the supply reel 62, and the carrier tape 31 andthe antenna base materials 51 are brought into close proximity to eachother.

As shown in FIG. 44, the tape-shaped main body 33 of the carrier tape 31is folded (bent) in the vicinity of the antenna base materials 51 toseparate the electronic component 32 with a seal material from thetape-shaped main body 33. At the time of separation, while theelectronic component 32 with a seal material is being separated from thetape-shaped main body 33, a pair of the terminal electrodes 35 a, 35 bof the electronic component 32 with a seal material is connected to thefirst terminal 52 aa and the second terminal 52 ba of the antennaelement 52 (see FIG. 41) transported in the direction intersecting withthe transport direction of the carrier tape 31.

More specifically, by folding the tape-shaped main body of the carriertape 31 in the vicinity of the antenna base materials 51, one endportion of the seal material 34 first peels off from the tape-shapedmain body 33. The one end portion of the seal material 34 adheres by theadhesive force of the adhesive layer 34 a to the antenna base material51 transported in the direction intersecting with the transportdirection of the carrier tape 31. Subsequently, as the carrier tape 31and the antenna base material 51 move further, the pair of the terminalelectrodes 35 a, 35 b is connected to the first terminal 52 aa and thesecond terminal 52 ba of the antenna element 52 (see FIG. 41).Subsequently, as the carrier tape 31 and the antenna base material 51move further, the other end portion of the seal material 34 peels offfrom the tape-shaped main body 33. The other end portion of the sealmaterial 34 adheres by the adhesive force of the adhesive layer 34 a tothe antenna base material 51 transported in the direction intersectingwith the transport direction of the carrier tape 31. As a result, theRFID tag 50 shown in FIGS. 40 and 41 is manufactured. By sequentiallyperforming this operation, a plurality of RFID tags 50 is able to bemanufactured.

With the method for manufacturing an RFID tag according to the sixthpreferred embodiment, the plurality of the electronic components 32 withseal materials is housed in the carrier tape 31 and, therefore, thehandleability of the plurality of the electronic components 32 with sealmaterials is improved. Additionally, since the seal materials 34necessary for manufacturing the RFID tags 50 are affixed to thetape-shaped main body 33 to retain the electronic components 35, it isnot necessary to provide another member that is unnecessary formanufacturing the RFID tags 50 to retain the electronic components 35 inthe housing holes 33 a. Moreover, since the electronic components 32with seal materials are separated from the tape-shaped main body 33 bysimply folding the tape-shaped main body 33, the number of manufacturingsteps and the manufacturing costs are reduced. An angle of the fold ofthe tape-shaped main body 33 and a degree of curvature at the foldedposition may appropriately be set in consideration of the adhesive forcebetween the electronic components 32 with seal materials and thetape-shaped main body 33 etc.

With to the method for manufacturing an RFID tag according to the sixthpreferred embodiment, while the carrier tape 31 is continuously pulledout from the supply reel 61, the tape-shaped main body 33 of thepulled-out carrier tape 31 is folded at a certain position away from thesupply reel 61. As a result, the plurality of the electronic components32 with seal materials is sequentially separated from the tape-shapedmain body 33 and sequentially affixed to the antenna base materials 51pulled out from the supply reel 62. Therefore, for example, the carriertape 31 is pulled out at a rate of several dozen meters per minute toseparate the plurality of the electronic components 35 from thetape-shaped main body 33 at high speed. Consequently, a plurality of theRFID tags 50 are able to be manufactured in shorter time.

Preferably, the seal materials 34 have a shape, e.g., a rectangularshape, having a longitudinal direction and a transverse direction in aplanar view and, when the electronic components 32 with seal materialsare each separated from the tape-shaped main body 33, a portion in thelongitudinal direction of the seal material 34 is first separated. As aresult, the electronic components 32 with seal materials are able to bemore easily separated from the tape-shaped main body 33.

The seal materials 34 preferably have a higher rigidity than thetape-shaped main body 33. As a result, when the tape-shaped main body 33is folded, the separation of the seal materials 34 from the tape-shapedmain body 33 is facilitated. Therefore, the seal materials 34 arepreferably made of a material having a quality or property associatedwith a larger elastic force (resilience), such as a larger Young'smodulus and a greater thickness, than the tape-shaped main body 33.

After the separation of the electronic components 32 with sealmaterials, the carrier tape 31 may be wound around a winding reel (notshown). In particular, the carrier tape 31 may preferably be transportedby a roll-to-roll technique. Similarly, the antenna base materials 51including the antenna elements 52 provided thereon may preferably betransported by a roll-to-roll technique.

In the example of manufacturing shown in FIGS. 43 and 44, the electroniccomponents 32 with seal materials separated from the tape-shaped mainbody 33 are directly affixed to the antenna base materials 51, this isnot a limitation of the present invention. For example, as shown inFIGS. 45 and 46, the electronic components 32 with seal materialsseparated from the tape-shaped main body 33 may be affixed to theantenna base materials 51 using a conveyer 63.

More specifically, the carrier tape 31 pulled out from the supply reel61 is folded at a certain position spaced away from the supply reel 61to separate the electronic component 32 with a seal material from thetape-shaped main body 33. The separated electronic component 32 with aseal material is conveyed by the conveyer 63 to the vicinity of theantenna base material 51 including the antenna element 52 thereon pulledout from the supply reel 62. As a result, the electronic component 32with a seal material is affixed to the antenna base material 51 pulledout from the supply reel 62 such that a pair of the terminal electrodes35 a, 35 b is connected to the first terminal 52 aa and the secondterminal 52 ba. By sequentially performing this operation, a pluralityof the RFID tags 50 are able to be manufactured.

According to this configuration, the adjustment of machinery isfacilitated and the electronic components 32 with seal materials areable to be more accurately affixed to the antenna base materials 51. Tofold the carrier tape 31 and the antenna base materials 51, for example,rollers may be disposed at corresponding folding portions and thecarrier tape 31 and the antenna base materials 51 may be transportedalong or around the rollers.

The conveyer 63 may be an apparatus, such as a suction head, instead ofa belt-conveyor apparatus as shown in FIGS. 45 and 46. In particular,the electronic component 35 with a seal material separated from thetape-shaped main body 33 may be sucked by a suction head and affixed tothe antenna base material 51.

The preferred embodiments of the present invention are illustrative andthe constituent elements described in the different preferredembodiments can be partially replaced or combined. In the second andlater preferred embodiments, the details common to the first preferredembodiment are not described and only the differences are described.Particularly, the same actions and effects of the same constituentelements are not repeatedly mentioned for each of the preferredembodiments.

Since the handleability of the electronic components with seal materialsis improved, preferred embodiments of the present invention are usefulfor manufacturing of RFID tags, a carrier tape used in themanufacturing, and a method for manufacturing the same.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A method for manufacturing a carrier tape housinga plurality of electronic components with seal materials, the methodcomprising the steps of: preparing a tape-shaped main body including aplurality of housing holes including bottom surfaces and arranged alonga longitudinal direction; providing chip-shaped electronic componentsrespectively into the plurality of the housing holes; affixing atape-shaped seal material including an adhesive layer on one principalsurface to the tape-shaped main body such that the adhesive layer coversthe housing holes and adheres to the electronic components; and formingcuts in the tape-shaped seal material to separate portions defining andfunctioning as the seal materials including portions at least partiallyoverlapping with the respective housing holes in a planar view from theother portions.
 2. The method for manufacturing a carrier tape accordingto claim 1, wherein a depth of the housing holes is equal orsubstantially equal to a thickness of the electronic components or lessthan the thickness of the electronic components.
 3. The method formanufacturing a carrier tape according to claim 1, further comprising astep of separating the portions other than those defining andfunctioning as the seal materials from the tape-shaped main body afterthe cuts are formed in the tape-shaped seal material.
 4. The method formanufacturing a carrier tape according to claim 1, wherein theelectronic components each include a pair of terminal electrodes on asurface thereof on a side opposite to a fixation surface adhered to theadhesive layer of the seal material.
 5. The method for manufacturing acarrier tape according to claim 1, wherein the electronic componentseach include a pair of terminal electrodes and are each adhered throughthe pair of the terminal electrodes to the adhesive layer of the sealmaterial.
 6. A carrier tape housing a plurality of electronic componentswith seal materials, the carrier tape comprising: a tape-shaped mainbody including a plurality of housing holes including bottom surfacesand arranged along a longitudinal direction; a plurality of chip-shapedelectronic components respectively housed in the plurality of thehousing holes; and a plurality of seal materials including an adhesivelayer on one principal surface and affixed to the tape-shaped main bodysuch that the adhesive layer covers the housing holes and adheres to theelectronic components.
 7. The carrier tape according to claim 6, whereinthe seal materials have a rigidity higher than that of the tape-shapedmain body.
 8. The carrier tape according to claim 6, wherein theelectronic components are RFID tags that each include an RFIC chip and asubstrate on which the RFIC chip is mounted.
 9. The carrier tapeaccording to claim 8, wherein the substrate is a substrate of an RFIDtag and includes a power feeding circuit that performs impedancematching between an antenna element and the RFIC chip.
 10. The carriertape according to claim 6, wherein the electronic components eachinclude a pair of terminal electrodes and are each adhered through thepair of the terminal electrodes to the adhesive layer of the sealmaterial.
 11. The carrier tape according to claim 6, wherein theelectronic components each include a pair of terminal electrodes on asurface thereof on a side opposite to a fixation surface adhered to theadhesive layer of the seal material.
 12. The carrier tape according toclaim 6, wherein each of the plurality of seal materials has a sizelarger than each of the plurality of housing holes so as to completelycover each of the plurality of housing holes.
 13. The carrier tapeaccording to claim 6, wherein each of the plurality of seal materialshas a rectangular or substantially rectangular belt shape, and isadhered to a portion of a fixation surface of a respective one of theelectronic components so as to extend in a direction perpendicular orsubstantially perpendicular to a longitudinal direction of theelectronic component.
 14. A method for manufacturing an RFID tagcomprising the steps of: preparing a carrier tape housing a plurality ofRFIC elements with seal materials, the carrier tape including atape-shaped main body that includes a plurality of housing holesincluding bottom surfaces along a longitudinal direction, a plurality ofchip-shaped RFIC elements respectively housed in the plurality of thehousing holes, and a plurality of seal materials including an adhesivelayer on one principal surface thereof and affixed to the tape-shapedmain body such that the adhesive layer covers the housing holes andadheres to the RFIC elements; folding the tape-shaped main body toseparate each of the RFIC elements with seal materials from thetape-shaped main body; and affixing the separated RFIC element with aseal material to an antenna base material by the adhesive layer of theseal material.
 15. The method for manufacturing an RFID tag according toclaim 14, wherein the carrier tape is wound around a supply reel; andwhile the carrier tape is continuously pulled out from the supply reel,the tape-shaped main body of the pulled-out carrier tape is folded at alocation away from the supply reel to sequentially separate theplurality of the RFIC elements with seal materials from the tape-shapedmain body.
 16. The method for manufacturing an RFID tag according toclaim 14, wherein the seal materials extend in a longitudinal directionand a transverse direction in a planar view; when each of the RFICelements with seal materials is separated from the tape-shaped mainbody, a portion in the longitudinal direction of the seal material isseparated first.
 17. The method for manufacturing an RFID tag accordingto claim 16, wherein the RFIC elements each include a pair of terminalelectrodes and are each adhered through the pair of the terminalelectrodes to the adhesive layer of the seal material; when the RFICelements with seal materials are each affixed to the antenna basematerial by the adhesive layer of the seal material, a portion of eachof the pair of the terminal electrodes is connected to an antennaconductor provided on the antenna base material.